Jet Impingement Manifolds for Cooling Power Electronics Modules

Gilbert Moreno; Sreekant Narumanchi; Kevin Bennion; Ramchandra Kotecha; Paul Paret; Xuhui Feng

Jet Impingement Manifolds for Cooling Power Electronics Modules

Gilbert Moreno (Inventor)
, Sreekant Narumanchi (Inventor)
, Kevin Bennion (Inventor)
, Ramchandra Kotecha (Inventor)
, Paul Paret (Inventor)
, Xuhui Feng (Inventor)

Center for Integrated Mobility Sciences

National Renewable Energy Laboratory

Research output: Patent

Abstract

The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

Original language	American English
Patent number	11,751,365 B2
Filing date	5/09/23
State	Published - 2023

NLR Publication Number

NREL/PT-5400-87441

Keywords

electrical conductor
first block
power electronics module
second block

Access to Document

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11751365

Cite this

@misc{d568600e3d2a4ce2ab01dc352d906ab8,

title = "Jet Impingement Manifolds for Cooling Power Electronics Modules",

abstract = "The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.",

keywords = "electrical conductor, first block, power electronics module, second block",

author = "Gilbert Moreno and Sreekant Narumanchi and Kevin Bennion and Ramchandra Kotecha and Paul Paret and Xuhui Feng",

year = "2023",

language = "American English",

type = "Patent",

note = "11,751,365 B2",

}

TY - PAT

T1 - Jet Impingement Manifolds for Cooling Power Electronics Modules

AU - Moreno, Gilbert

AU - Narumanchi, Sreekant

AU - Bennion, Kevin

AU - Kotecha, Ramchandra

AU - Paret, Paul

AU - Feng, Xuhui

PY - 2023

Y1 - 2023

N2 - The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

AB - The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

KW - electrical conductor

KW - first block

KW - power electronics module

KW - second block

M3 - Patent

M1 - 11,751,365 B2

Y2 - 2023/09/05

ER -

Jet Impingement Manifolds for Cooling Power Electronics Modules

Abstract

NLR Publication Number

Keywords

Access to Document

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Cite this