Laser Cutting and Micromachining for Localized and Targeted Solar Cell Characterization

Steven Johnston; Dana Kern; George Kroeger

doi:10.1109/PVSC40753.2019.8981290

Laser Cutting and Micromachining for Localized and Targeted Solar Cell Characterization

Steven Johnston, Dana Kern, George Kroeger

Materials Science

Kroeger Inc.

Research output: Contribution to conference › Paper › peer-review

8 Scopus Citations

Abstract

Laser cutting and micromachining can be applied to solar cell materials for processing and characterization applications. An ultrashort pulse (USP) laser with sub-picosecond pulse width can remove material with minimal thermal effects or damage, which is termed 'cold ablation'. Such USP laser cutting and scribing can be implemented for isolating areas within a larger cell while maintaining electrical performance and preventing laser-induced damage and shunting. Laser micromachining has been used to isolate a shunt to improve cell performance and to isolate a small, selected area to define a sample suitable for deep level transient spectroscopy.

Original language	American English
Pages	2753-2757
Number of pages	5
DOIs	https://doi.org/10.1109/PVSC40753.2019.8981290 https://doi.org/10.1109/PVSC40753.2019.8981290
State	Published - Jun 2019
Event	46th IEEE Photovoltaic Specialists Conference, PVSC 2019 - Chicago, United States Duration: 16 Jun 2019 → 21 Jun 2019

Conference

Conference	46th IEEE Photovoltaic Specialists Conference, PVSC 2019
Country/Territory	United States
City	Chicago
Period	16/06/19 → 21/06/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

NREL Publication Number

NREL/CP-5K00-73137

Keywords

deep level transient spectroscopy
laser beam cutting
laser beam effects
laser beam machining
micromachining
solar cells

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title = "Laser Cutting and Micromachining for Localized and Targeted Solar Cell Characterization",

abstract = "Laser cutting and micromachining can be applied to solar cell materials for processing and characterization applications. An ultrashort pulse (USP) laser with sub-picosecond pulse width can remove material with minimal thermal effects or damage, which is termed 'cold ablation'. Such USP laser cutting and scribing can be implemented for isolating areas within a larger cell while maintaining electrical performance and preventing laser-induced damage and shunting. Laser micromachining has been used to isolate a shunt to improve cell performance and to isolate a small, selected area to define a sample suitable for deep level transient spectroscopy.",

keywords = "deep level transient spectroscopy, laser beam cutting, laser beam effects, laser beam machining, micromachining, solar cells",

author = "Steven Johnston and Dana Kern and George Kroeger",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 46th IEEE Photovoltaic Specialists Conference, PVSC 2019 ; Conference date: 16-06-2019 Through 21-06-2019",

year = "2019",

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doi = "10.1109/PVSC40753.2019.8981290",

language = "American English",

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AU - Johnston, Steven

AU - Kern, Dana

AU - Kroeger, George

PY - 2019/6

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N2 - Laser cutting and micromachining can be applied to solar cell materials for processing and characterization applications. An ultrashort pulse (USP) laser with sub-picosecond pulse width can remove material with minimal thermal effects or damage, which is termed 'cold ablation'. Such USP laser cutting and scribing can be implemented for isolating areas within a larger cell while maintaining electrical performance and preventing laser-induced damage and shunting. Laser micromachining has been used to isolate a shunt to improve cell performance and to isolate a small, selected area to define a sample suitable for deep level transient spectroscopy.

AB - Laser cutting and micromachining can be applied to solar cell materials for processing and characterization applications. An ultrashort pulse (USP) laser with sub-picosecond pulse width can remove material with minimal thermal effects or damage, which is termed 'cold ablation'. Such USP laser cutting and scribing can be implemented for isolating areas within a larger cell while maintaining electrical performance and preventing laser-induced damage and shunting. Laser micromachining has been used to isolate a shunt to improve cell performance and to isolate a small, selected area to define a sample suitable for deep level transient spectroscopy.

KW - deep level transient spectroscopy

KW - laser beam cutting

KW - laser beam effects

KW - laser beam machining

KW - micromachining

KW - solar cells

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DO - 10.1109/PVSC40753.2019.8981290

M3 - Paper

AN - SCOPUS:85081571913

SP - 2753

EP - 2757

T2 - 46th IEEE Photovoltaic Specialists Conference, PVSC 2019

Y2 - 16 June 2019 through 21 June 2019

ER -

Laser Cutting and Micromachining for Localized and Targeted Solar Cell Characterization

Abstract

Conference

Bibliographical note

NREL Publication Number

Keywords

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