Abstract
Methods of fabricating a semiconductor layer or device and said devices are disclosed. The methods include but are not limited to providing a metal or metal alloy substrate having a crystalline surface with a known lattice parameter (a). The methods further include growing a crystalline semiconductor alloy layer on the crystalline substrate surface by coincident site lattice matched epitaxy. The semiconductor layer may be grown without any buffer layer between the alloy and the crystalline surface of the substrate. The semiconductor alloy may be prepared to have a lattice parameter (a') that is related to the lattice parameter (a). The semiconductor alloy may further be prepared to have a selected band gap.
Original language | American English |
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Patent number | 8,575,471 |
Filing date | 5/11/13 |
State | Published - 2013 |
Bibliographical note
Assignee: Alliance for Sustainable Energy, LLC (Golden, CO)NREL Publication Number
- NREL/PT-5200-62091