Liquid Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages Paper No. EP-18-1031

Engineering

• Power Electronics 100%
• Baseplate 100%
• Thermal Performance 50%
• Nitride 50%
• Dielectric Layer 50%
• Microchannel 50%
• Copper (Cu) 50%
• Cycling Stability 50%
• Pumping Power 50%
• Power Electronic Device 50%
• Coefficient of Thermal Expansion 50%
• Limiting Factor 50%
• Heat Transfer Coefficient 50%
• Heat Transfer Enhancement 50%
• Heat Resistance 50%
• Liquid Cooling 50%

Material Science

• Aluminum 100%
• Silicon Carbide 100%
• Thermal Cycling 40%
• Electronic Circuit 20%
• Thermal Expansion 20%
• Heat Resistance 20%
• Aluminum Nitride 20%
• Dielectric Material 20%