Abstract
We present progress to develop low-cost interdigitated back contact solar cells with pc-Si/SiO2/c-Si passivated contacts formed by plasma immersion ion implantation (PIII). PIII is a lower-cost implantation technique than traditional beam line implantation due to its simpler design, lower operating costs, and ability to run high doses (1E14–1E18 cm−2) at low ion energies (20 eV–10 keV). These benefits make PIII ideal for high throughput production of patterned passivated contacts, where high-dose, low-energy implantations are made into thin (20–200 nm) a-Si layers instead of into the wafer itself. For this work symmetric passivated contact test structures (~100 nm thick) grown on n-Cz wafers with pH3 PIII doping gave implied open circuit voltage (iVoc) values of 730 mV with Jo values of 2 fA/cm2. Samples doped with B2H6 gave iVoc values of 690 mV and Jo values of 24 fA/cm2, outperforming BF3 doping, which gave iVoc values in the 660–680 mV range. Samples were further characterized by SIMS, photoluminescence, TEM, EELS, and post-metallization TLM to reveal micro- and macro-scopic structural, chemical and electrical information.
Original language | American English |
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Pages (from-to) | 68-76 |
Number of pages | 9 |
Journal | Solar Energy Materials and Solar Cells |
Volume | 158 |
Issue number | 1 |
DOIs | |
State | Published - 1 Dec 2016 |
Bibliographical note
Publisher Copyright:© 2016
NREL Publication Number
- NREL/JA-5J00-66528
Keywords
- Passivated contacts
- Plasma immersion ion implantation
- Silicon
- Solar cells