Low-Cost, Single-Layer Relacement for the Back-Sheet and Encapsulant Layers: Preprint

Michael Kempe

Low-Cost, Single-Layer Relacement for the Back-Sheet and Encapsulant Layers: Preprint

Michael Kempe

Materials Science

Research output: Contribution to conference › Paper

Abstract

Encapsulant materials are used in a variety of applications to isolate components, areas, or other materials from potentially stressful conditions that can adversely affect the performance of a device.

Original language	American English
Number of pages	15
State	Published - 2008
Event	2008 SPIE PV Reliability Symposium - San Diego, California Duration: 10 Aug 2008 → 14 Aug 2008

Conference

Conference	2008 SPIE PV Reliability Symposium
City	San Diego, California
Period	10/08/08 → 14/08/08

NLR Publication Number

NREL/CP-520-42795

Keywords

back-sheet
encapsulant layers
ethylene propylene diene monomer
ethylene vinyl acetate
EVA
low-cost
polymers
PV
single layer replacement

Access to Document

https://www.nrel.gov/docs/fy08osti/42795.pdf

Cite this

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title = "Low-Cost, Single-Layer Relacement for the Back-Sheet and Encapsulant Layers: Preprint",

abstract = "Encapsulant materials are used in a variety of applications to isolate components, areas, or other materials from potentially stressful conditions that can adversely affect the performance of a device.",

keywords = "back-sheet, encapsulant layers, ethylene propylene diene monomer, ethylene vinyl acetate, EVA, low-cost, polymers, PV, single layer replacement",

author = "Michael Kempe",

year = "2008",

language = "American English",

note = "2008 SPIE PV Reliability Symposium ; Conference date: 10-08-2008 Through 14-08-2008",

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TY - CONF

T1 - Low-Cost, Single-Layer Relacement for the Back-Sheet and Encapsulant Layers: Preprint

AU - Kempe, Michael

PY - 2008

Y1 - 2008

N2 - Encapsulant materials are used in a variety of applications to isolate components, areas, or other materials from potentially stressful conditions that can adversely affect the performance of a device.

AB - Encapsulant materials are used in a variety of applications to isolate components, areas, or other materials from potentially stressful conditions that can adversely affect the performance of a device.

KW - back-sheet

KW - encapsulant layers

KW - ethylene propylene diene monomer

KW - ethylene vinyl acetate

KW - EVA

KW - low-cost

KW - polymers

KW - PV

KW - single layer replacement

M3 - Paper

T2 - 2008 SPIE PV Reliability Symposium

Y2 - 10 August 2008 through 14 August 2008

ER -

Low-Cost, Single-Layer Relacement for the Back-Sheet and Encapsulant Layers: Preprint

Abstract

Conference

NLR Publication Number

Keywords

Access to Document

Fingerprint

Cite this