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Low Cost, Single Layer Replacement for the Back-Sheet and Encapsulant Layers
Michael D. Kempe
, Prem Thapa
Materials Science
BRP Manufacturing
Research output
:
Contribution to conference
›
Paper
›
peer-review
6
Scopus Citations
Overview
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Dive into the research topics of 'Low Cost, Single Layer Replacement for the Back-Sheet and Encapsulant Layers'. Together they form a unique fingerprint.
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Weight
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Engineering
Back Sheet
100%
Tedlar
75%
Ethylene-Propylene-Diene-Monomer
75%
Electrical Insulation
50%
Delamination
50%
Back Side
25%
Material Cost
25%
Layer Thickness
25%
Material Layer
25%
Photovoltaic Modules
25%
Term Stability
25%
Damp Heat
25%
Module Design
25%
Cure Cycle
25%
Protective Material
25%
Relative Humidity
25%
Stainless Steel
25%
Corrosion Protection
25%
Melting Point
25%
Reflectance
25%
Material Science
Delamination
100%
Film
50%
Reflectivity
50%
Photovoltaic Modules
50%
Glass Transition Temperature
50%
Stainless Steel
50%
Corrosion Protection
50%
Steel Sheet
50%