Skip to main navigation
Skip to search
Skip to main content
National Laboratory of the Rockies Hub Home
Hub Home
Researcher Profiles
Research Output
Research Organizations
Awards & Honors
Activities
Search by expertise, name, or affiliation
Low Thermal Resistance Power Module Assembly
NREL
(Inventor)
Center for Integrated Mobility Sciences
Research output
:
Patent
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Low Thermal Resistance Power Module Assembly'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Engineering
Bonding Layer
100%
Heat Resistance
100%
Heat Losses
33%
Medicine and Dentistry
Heat Tolerance
100%
Dissipation
50%