Market-Driven EFG Modules: Final Report, 14 December 1995 - 30 June 1999

    Research output: NRELSubcontract Report


    This report describes the progress made in the 3-year program at ASE Americas, Inc., in the Photovoltaic Manufacturing Technology 4A2 Initiative on developing Edge-Defined Film-Fed Growth (EFG) silicon wafer technology. The work performed under this subcontract focused on advancing EFG manufacturing technology and lowering production costs in three areas: 1) EFG wafers - through better siliconfeedstock utilization, ASE realized improvements in growth, a wafer thickness reduction from 300 to 250 microns, and a higher bulk wafer electronic quality; additionally, new technology for the laser cutting of wafers was demonstrated; 2) Solar cells - by an increase in solar cell efficiency and by implementing a new glass-etch process; 3) Modules - by lamination cycle improvements, introducinga new diode housing, and simplifying module construction.; The program will exceed its overall goal of reducing EFG module manufacturing costs by 25%. About 17% of these improvements are already implemented in manufacturing. Technology to achieve an additional cost savings of 11% is in the final stages of introduction into large-scale manufacturing.
    Original languageAmerican English
    Number of pages32
    StatePublished - 1999

    Bibliographical note

    Work performed by ASE Americas, Inc., Billerica, Massachusetts

    NREL Publication Number

    • NREL/SR-520-26833


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