Mechanisms of Adhesion Degradation at the Photovoltiac Module's Cell Metallization-Encapsulant Interface

Nick Bosco, Stephanie Moffitt, Laura T. Schelhas

Research output: Contribution to journalArticlepeer-review

17 Scopus Citations

Abstract

Adhesion measurements and chemical characterization of the encapsulant/silver metallization interface of a photovoltaic (PV) module through temperature, humidity, and voltage bias exposures were conducted. Results demonstrate two independent degradation mechanisms: (a) with voltage bias, the ionic conduction of Na + ions through the encapsulant results in the formation of sodium silicate at the silver metallization surface, thereby weakening that interface and (b) with moisture ingress, dissociation of the silane bonding to silver in the silver oxide similarly weakens this interface resulting in significantly lower debond energies.

Original languageAmerican English
Pages (from-to)340-345
Number of pages6
JournalProgress in Photovoltaics: Research and Applications
Volume27
Issue number4
DOIs
StatePublished - 2019

Bibliographical note

Publisher Copyright:
© 2019 John Wiley & Sons, Ltd.

NREL Publication Number

  • NREL/JA-5K00-72105

Keywords

  • degradation
  • encapsulation
  • metallization
  • photovoltaic module
  • reliability
  • screen printing

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