Metal-Organic-Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

Xuhui Feng, Sreekant Narumanchi, Cengiz Yegin, Nirup Nagabandi, Massimo Catalano, Jun Oh, Ansam Talib, Ethan Scholar, Stanislav Verkhoturov, Tahir Cagin, Alexei Sokolov, Moon Kim, Kaiser Matin, Mustafa Akbulut, Charles King

Research output: Contribution to journalArticlepeer-review

18 Scopus Citations

Abstract

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix-which are prepared by the chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m K), which are very high considering their relatively low elastic modulus values on the order of 21.2-28.5 GPa. The synergistic combination of these properties led to the ultralow total thermal resistivity values in the range of 0.38-0.56 mm2 K/W for a typical bond-line thickness of 30-50 μm, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

Original languageAmerican English
Pages (from-to)10120-10127
Number of pages8
JournalACS Applied Materials and Interfaces
Volume9
Issue number11
DOIs
StatePublished - 22 Mar 2017

Bibliographical note

Publisher Copyright:
© 2017 American Chemical Society.

NREL Publication Number

  • NREL/JA-5400-68044

Keywords

  • boron nitride nanosheets
  • hybrid nanocomposites
  • nanomaterials
  • nanostructures
  • thermal conductivity
  • thermal interface materials
  • thermal management

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