Metal Pillar Interconnection Topology for Bonded Two-Terminal Multijunction III-V Solar Cells

W. E. McMahon, C. T. Lin, J. S. Ward, J. F. Geisz, M. W. Wanlass, J. J. Carapella, W. Olavarría, M. Young, M. A. Steiner, R. M. France, A. E. Kibbler, A. Duda, J. M. Olson, E. E. Perl, D. J. Friedman, J. E. Bowers

Research output: Contribution to journalArticlepeer-review

17 Scopus Citations

Abstract

Metal-interconnected multijunction solar cells offer one pathway toward efficiencies in excess of 50%. However, if a three-or four-terminal configuration is used, optical losses from the interfacial grid can be considerable. Here, we examine an alternative that provides an optimal interconnection for two-terminal bonded devices. This 'pillar-array' topology is optimized by minimizing the sum of all power losses, including shadow losses and numerically computed electrical losses. Numerical modeling is used to illustrate the benefit of a pillar-array interfacial metallization for some two-terminal configurations.

Original languageAmerican English
Article number6407636
Pages (from-to)868-872
Number of pages5
JournalIEEE Journal of Photovoltaics
Volume3
Issue number2
DOIs
StatePublished - 2013

NREL Publication Number

  • NREL/JA-5200-55334

Keywords

  • Bonding processes
  • III-V semiconductor materials
  • optimization
  • photovoltaic cells
  • semiconductor device modeling

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