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Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint
Xuhui Feng
,
Sreekant Narumanchi
, Nirup Nagabandi
, Jun Oh
, Mustafa Akbulut
, Cengiz Yegin
, Charles King
Center for Integrated Mobility Sciences
Texas A&M University
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Dive into the research topics of 'Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint'. Together they form a unique fingerprint.
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Material Science
Interface (Material)
100%
Nanocomposite
100%
Nanosheet
33%
Boron Nitride
33%
Cathode
22%
Electrochemical Reaction
11%
Silicon
11%
Contact Resistance
11%
Thermal Conductivity
11%
Thermal Expansion
11%
Heat Resistance
11%
Electrodeposition
11%
Chemisorption
11%
Aluminum
11%
Nucleation
11%
Nanoindentation
11%
Grain Boundary
11%
Engineering
Material Interface
100%
Nanocomposites
100%
Boron Nitride Nanosheets
33%
Transients
22%
Coefficient of Thermal Expansion
11%
Simplifies
11%
Diffusive
11%
Led Device
11%
Soft Material
11%
Source Material
11%
Bondlines
11%
Analyze Phase
11%
Thermal Conductivity
11%
Heat Sources
11%
Heat Flux
11%
Actuator
11%
Heat Resistance
11%