Abstract
A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed.
Original language | American English |
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Patent number | 7,601,215 B1 |
State | Published - 2009 |
NREL Publication Number
- NREL/PT-520-47026