Method to Determine Maximum Allowable Sinterable Silver Interconnect Size

Engineering

• Interconnects 100%
• Delamination 100%
• Power Electronics 33%
• Bonding Temperature 33%
• Coefficient of Thermal Expansion 33%
• Material Combination 33%
• High Electrical Conductivity 33%
• High Thermal Conductivity 33%
• Room Temperature 33%
• Initiate Failure 33%
• Sintering Temperature 33%

Material Science

• Delamination 100%
• Silicon 33%
• Thermal Cycling 33%
• Thermal Conductivity 33%
• Electrical Conductivity 33%
• Thermal Expansion 33%
• Silicon Carbide 33%
• Invar 33%
• Proof Test 33%
• Sintering Temperature 33%
• Nickel Alloy 33%