Methods of Manipulating Stressed Epistructures

Mark Wanlass (Inventor)

Research output: Patent

Abstract

A method of processing an epistructure or processing a semiconductor device including associating a conformal and flexible handle with the epistructure and removing the epistructure and handle as a unit from the parent substrate. The method further includes causing the epistructure and handle unit to conform to a shape that differs from the shape the epistructure otherwise inherently assumes upon removal from the parent substrate. A device prepared according to the disclosed methods.
Original languageAmerican English
Patent number8,691,663
Filing date8/04/14
StatePublished - 2014

Bibliographical note

Assignee: Alliance for Sustainable Energy, LLC (Golden, CO)

NREL Publication Number

  • NREL/PT-5200-62973

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