Abstract
A method of processing an epistructure or processing a semiconductor device including associating a conformal and flexible handle with the epistructure and removing the epistructure and handle as a unit from the parent substrate. The method further includes causing the epistructure and handle unit to conform to a shape that differs from the shape the epistructure otherwise inherently assumes upon removal from the parent substrate. A device prepared according to the disclosed methods.
Original language | American English |
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Patent number | 8,691,663 |
Filing date | 8/04/14 |
State | Published - 2014 |
Bibliographical note
Assignee: Alliance for Sustainable Energy, LLC (Golden, CO)NREL Publication Number
- NREL/PT-5200-62973