Methods of Manipulating Stressed Epistructures

Mark Wanlass (Inventor)

    Research output: Patent

    Abstract

    A method of processing an epistructure or processing a semiconductor device including associating a conformal and flexible handle with the epistructure and removing the epistructure and handle as a unit from the parent substrate. The method further includes causing the epistructure and handle unit to conform to a shape that differs from the shape the epistructure otherwise inherently assumes upon removal from the parent substrate. A device prepared according to the disclosed methods.
    Original languageAmerican English
    Patent number8,691,663
    Filing date8/04/14
    StatePublished - 2014

    Bibliographical note

    Assignee: Alliance for Sustainable Energy, LLC (Golden, CO)

    NREL Publication Number

    • NREL/PT-5200-62973

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