Abstract
Our team activities are directed at improving PV module reliability by incorporating new, more effective, and less expensive packaging materials and techniques. New and existing materials or designs are evaluated before and during accelerated environmental exposure for the following properties: (1) Adhesion and cohesion: peel strength and lap shear. (2) Electrical conductivity: surface, bulk,interface and transients. (3) Water vapor transmission: solubility and diffusivity. (4) Accelerated weathering: ultraviolet, temperature, and damp heat tests. (5) Module and cell failure diagnostics: infrared imaging, individual cell shunt characterization, coring. (6) Fabrication improvements: SiOxNy barrier coatings and enhanced wet adhesion. (7) Numerical modeling: Moisture ingress/egress,module and cell performance, and cell-to-frame leakage current. (8) Rheological properties of polymer encapsulant and sheeting materials. Specific examples will be described.
| Original language | American English |
|---|---|
| Number of pages | 5 |
| State | Published - 2005 |
| Event | 2004 DOE Solar Energy Technologies Program Review Meeting - Denver, Colorado Duration: 25 Oct 2004 → 28 Oct 2004 |
Conference
| Conference | 2004 DOE Solar Energy Technologies Program Review Meeting |
|---|---|
| City | Denver, Colorado |
| Period | 25/10/04 → 28/10/04 |
Bibliographical note
Presented at the 2004 DOE Solar Energy Technologies Program Review Meeting, 25-28 October 2004, Denver, Colorado. Also included in the proceedings available on CD-ROM (DOE/GO-102005-2067; NREL/CD-520-37140)NREL Publication Number
- NREL/CP-520-36988
Keywords
- electrical conductivity
- fabrication
- infrared imaging
- module
- numerical modeling
- PV
- rheological properties
- water vapor transmission