Module Encapsulant Diagnostic and Modeling

Encapsulant materials are used in photovoltaic devices for mechanical support, electrical isolation, and protection against corrosion. The ability of an encapsulant to protect against surface corrosion is related to its adhesional strength. The adhesion of candidate encapsulants under accelerated environmental stress was examined to determine what materials have the best hydrolytic stability andare more likely to reduce corrosion rates. Under environmental exposure, the ingress of water has been correlated with increased corrosion rates. The diffusivity of different encapsulants has been measured to determine how long it takes for water to enter a module. The high diffusivity of ethylene vinyl acetate indicates that, even with the use of an impermeable back-sheet, moisture from thesides will diffuse throughout the entire module. To significantly reduce moisture ingress requires a true hermetic seal, the use of an encapsulant loaded with desiccant, or the use of a very low diffusivity encapsulant.