Module Packaging Research and Reliability: Activities and Capabilities

Research output: Contribution to conferencePaper

Abstract

Our team activities are directed at improving PV module reliability by incorporating new, more effective, and less expensive packaging materials and techniques. New and existing materials or designs are evaluated before and during accelerated environmental exposure for the following properties: (1) Adhesion and cohesion: peel strength and lap shear. (2) Electrical conductivity: surface, bulk,interface and transients. (3) Water vapor transmission: solubility and diffusivity. (4) Accelerated weathering: ultraviolet, temperature, and damp heat tests. (5) Module and cell failure diagnostics: infrared imaging, individual cell shunt characterization, coring. (6) Fabrication improvements: SiOxNy barrier coatings and enhanced wet adhesion. (7) Numerical modeling: Moisture ingress/egress,module and cell performance, and cell-to-frame leakage current. (8) Rheological properties of polymer encapsulant and sheeting materials. Specific examples are described.
Original languageAmerican English
Number of pages5
StatePublished - 2005
Event2005 DOE Solar Energy Technologies Program Review Meeting - Denver, Colorado
Duration: 7 Nov 200510 Nov 2005

Conference

Conference2005 DOE Solar Energy Technologies Program Review Meeting
CityDenver, Colorado
Period7/11/0510/11/05

Bibliographical note

Presented at the 2005 DOE Solar Energy Technologies Program Review Meeting held November 7-10, 2005 in Denver, Colorado. Also included in the proceedings available on CD-ROM (DOE/GO-102006-2245; NREL/CD-520-38557)

NREL Publication Number

  • NREL/CP-520-38931

Keywords

  • module packaging
  • NREL
  • photovoltaics (PV)
  • PV
  • solar

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