Novel Module Architecture for Lower CapEx and Improved Recyclability for c-Si PV Modules

Ryan Ruhle; Larry Maple; Timothy DeLazzer; Steve Johnston; Dana Kern; Walajabad Sampath

doi:10.1109/PVSC48320.2023.10359878

Novel Module Architecture for Lower CapEx and Improved Recyclability for c-Si PV Modules

Ryan Ruhle
, Larry Maple
, Timothy DeLazzer
, Steve Johnston
, Dana Kern
, Walajabad Sampath

Materials Science

Colorado State University

Research output: Contribution to conference › Paper

Abstract

Photovoltaic (PV) energy production is currently increasing at a rate at which recycling is becoming necessary. A novel module architecture has been demonstrated that has potential for high value recycling for c-Si PV. This architecture eliminates the vacuum lamination process and cross-linked en capsulants. Functioning prototypes of c-Si have been fabricated for stress testing in collaboration with NREL. These modules are being tested against traditionally manufactured modules. Based on preliminary results, this module architecture is a potentially viable solution for improving the manufacturing cost and recyclability of PV modules while retaining module performance.

Original language	American English
Number of pages	4
DOIs	https://doi.org/10.1109/PVSC48320.2023.10359878
State	Published - 2023
Event	2023 IEEE 50th Photovoltaic Specialists Conference (PVSC) - San Juan, Puerto Rico Duration: 11 Jun 2023 → 16 Jun 2023

Conference

Conference	2023 IEEE 50th Photovoltaic Specialists Conference (PVSC)
City	San Juan, Puerto Rico
Period	11/06/23 → 16/06/23

NLR Publication Number

NREL/CP-5K00-88896

Keywords

computer architecture
manufacturing
microprocessors
photovoltaic systems
recycling
robustness
task analysis

Access to Document

10.1109/PVSC48320.2023.10359878

Cite this

@conference{634f76b099ea465682132b863142e8a6,

title = "Novel Module Architecture for Lower CapEx and Improved Recyclability for c-Si PV Modules",

abstract = "Photovoltaic (PV) energy production is currently increasing at a rate at which recycling is becoming necessary. A novel module architecture has been demonstrated that has potential for high value recycling for c-Si PV. This architecture eliminates the vacuum lamination process and cross-linked en capsulants. Functioning prototypes of c-Si have been fabricated for stress testing in collaboration with NREL. These modules are being tested against traditionally manufactured modules. Based on preliminary results, this module architecture is a potentially viable solution for improving the manufacturing cost and recyclability of PV modules while retaining module performance.",

keywords = "computer architecture, manufacturing, microprocessors, photovoltaic systems, recycling, robustness, task analysis",

author = "Ryan Ruhle and Larry Maple and Timothy DeLazzer and Steve Johnston and Dana Kern and Walajabad Sampath",

year = "2023",

doi = "10.1109/PVSC48320.2023.10359878",

language = "American English",

note = "2023 IEEE 50th Photovoltaic Specialists Conference (PVSC) ; Conference date: 11-06-2023 Through 16-06-2023",

}

TY - CONF

T1 - Novel Module Architecture for Lower CapEx and Improved Recyclability for c-Si PV Modules

AU - Ruhle, Ryan

AU - Maple, Larry

AU - DeLazzer, Timothy

AU - Johnston, Steve

AU - Kern, Dana

AU - Sampath, Walajabad

PY - 2023

Y1 - 2023

N2 - Photovoltaic (PV) energy production is currently increasing at a rate at which recycling is becoming necessary. A novel module architecture has been demonstrated that has potential for high value recycling for c-Si PV. This architecture eliminates the vacuum lamination process and cross-linked en capsulants. Functioning prototypes of c-Si have been fabricated for stress testing in collaboration with NREL. These modules are being tested against traditionally manufactured modules. Based on preliminary results, this module architecture is a potentially viable solution for improving the manufacturing cost and recyclability of PV modules while retaining module performance.

AB - Photovoltaic (PV) energy production is currently increasing at a rate at which recycling is becoming necessary. A novel module architecture has been demonstrated that has potential for high value recycling for c-Si PV. This architecture eliminates the vacuum lamination process and cross-linked en capsulants. Functioning prototypes of c-Si have been fabricated for stress testing in collaboration with NREL. These modules are being tested against traditionally manufactured modules. Based on preliminary results, this module architecture is a potentially viable solution for improving the manufacturing cost and recyclability of PV modules while retaining module performance.

KW - computer architecture

KW - manufacturing

KW - microprocessors

KW - photovoltaic systems

KW - recycling

KW - robustness

KW - task analysis

U2 - 10.1109/PVSC48320.2023.10359878

DO - 10.1109/PVSC48320.2023.10359878

M3 - Paper

T2 - 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC)

Y2 - 11 June 2023 through 16 June 2023

ER -

Novel Module Architecture for Lower CapEx and Improved Recyclability for c-Si PV Modules

Abstract

Conference

NLR Publication Number

Keywords

Access to Document

Fingerprint

Cite this