Optical Thermal Characterization Enables High-Performance Electronics Applications

Research output: NRELFact Sheet


NREL developed a modeling and experimental strategy to characterize thermal performance of materials. The technique provides critical data on thermal properties with relevance for electronics packaging applications. Thermal contact resistance and bulk thermal conductivity were characterized for new high-performance materials such as thermoplastics, boron-nitride nanosheets, copper nanowires, and atomically bonded layers. The technique is an important tool for developing designs and materials that enable power electronics packaging with small footprint, high power density, and low cost for numerous applications.
Original languageAmerican English
StatePublished - 2016

NREL Publication Number

  • NREL/FS-5400-65848


  • electronics packaging
  • thermal
  • thermal interface materials
  • thermoplastics
  • TIM


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