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Parametric Design Study of a Power Electronics Package
Paul Paret
Center for Integrated Mobility Sciences
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NREL
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Dive into the research topics of 'Parametric Design Study of a Power Electronics Package'. Together they form a unique fingerprint.
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Engineering
Power Electronics
100%
Material Interface
100%
Parametric Design
100%
Coefficient of Thermal Expansion
75%
Baseplate
50%
Accelerated Test
50%
Bonded Interface
50%
Critical Role
25%
Modeling Study
25%
Metrics
25%
Application Level
25%
Level Requirement
25%
Strain Energy Density
25%
Loading Condition
25%
Structural Design
25%
Individual Component
25%
Parametric Modeling
25%
Joints (Structural Components)
25%
Material Science
Interface (Material)
100%
Thermal Expansion
60%
Thermal Cycling
40%
Aluminum
40%
Energy Density
20%
Silicon Carbide
20%
Solder Joint
20%