@misc{643d4a6eac044679abb8dcb54080b8c5,
title = "Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation): NREL (National Renewable Energy Laboratory)",
abstract = "The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow forthe interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.",
keywords = "bonded interfaces, delamination, reliability, sintered-silver, stress intensity factor",
author = "Douglas DeVoto",
year = "2014",
language = "American English",
series = "Presented at the FY15 APEEM Kickoff Meeting, 18-20 November 2014, Oak Ridge National Laboratory, Oak Ridge, Tennessee",
type = "Other",
}