@misc{8796b6f4eef244a8a19a59ea89e37bb4,
title = "Performance and Reliability of Bonded Interfaces for High-Temperature Packaging",
abstract = "The presentation focuses on mechanical characterization, reliability evaluation and thermomechanical modeling of sintered silver bonded interface material. Two types of sintered silver material are being investigated in this study - first one based on nanosilver particles and the other one comprising of a mixture of nanosilver particles and micron-sized silver flakes. Shear stress results obtained as a function of displacement rates and ambient temperature are reported. Also, scanning acoustic microscopy images of samples for accelerated testing and thermomechanical modeling results are presented.",
keywords = "fracture mechanics, power electronics, reliability, sintered silver, thermal cycling, thermomechanical modeling",
author = "Paul Paret",
year = "2018",
language = "American English",
series = "Presented at the U.S. Department of Energy's Vehicle Technologies Office 2018 Annual Merit Review and Peer Evaluation Meeting, 18-21 June 2018, Washington, D.C.",
type = "Other",
}