@misc{47dcce1a15ce4c4eb2b760c380e4e38a,
title = "Performance and Reliability of Bonded Interfaces for High-Temperature Packaging",
abstract = "Sintered silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based and lead-free solders, especially at higher temperatures (>200 degrees C). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. Mechanical characterization tests that result in stress-strain curves and accelerated tests that produce cycles-to-failure result will be conducted. Also, we present a finite element method (FEM) modeling methodology that can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture mechanics-based approach is adopted in the FEM model, and J-integral/thermal cycle values are computed.",
keywords = "J-integral, power electronics, predictive lifetime model, sintered silver, thermomechanical modeling",
author = "Paul Paret",
year = "2017",
language = "American English",
series = "Presented at the Vehicle Technologies Annual Merit Review and Peer Evaluation Meeting, 5-9 June 2017, Washington, D.C.",
type = "Other",
}