Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

Research output: NRELPresentation


Sintered silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based and lead-free solders, especially at higher temperatures (>200 degrees C). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. Mechanical characterization tests that result in stress-strain curves and accelerated tests that produce cycles-to-failure result will be conducted. Also, we present a finite element method (FEM) modeling methodology that can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture mechanics-based approach is adopted in the FEM model, and J-integral/thermal cycle values are computed.
Original languageAmerican English
Number of pages20
StatePublished - 2017

Publication series

NamePresented at the Vehicle Technologies Annual Merit Review and Peer Evaluation Meeting, 5-9 June 2017, Washington, D.C.

NREL Publication Number

  • NREL/PR-5400-68078


  • J-integral
  • power electronics
  • predictive lifetime model
  • sintered silver
  • thermomechanical modeling


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