Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

Research output: NRELPresentation


The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200 degrees C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.
Original languageAmerican English
Number of pages21
StatePublished - 2018

Publication series

NamePresented at the 2018 Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 18-22 June 2018, Washington, D.C.

NREL Publication Number

  • NREL/PR-5400-72493


  • lifetime prediction models
  • power electronics
  • reliability
  • sintered silver
  • wide-bandgap device packaging


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