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Performance and Reliability of Bonded Interfaces for High-Temperature Packaging
Paul Paret
Center for Integrated Mobility Sciences
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NREL
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Dive into the research topics of 'Performance and Reliability of Bonded Interfaces for High-Temperature Packaging'. Together they form a unique fingerprint.
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Engineering
Bonded Interface
100%
Band Gap
75%
Power Electronics
50%
Failure Mechanism
50%
Thermal Performance
25%
High Temperature Operations
25%
Transients
25%
Induced Stress
25%
Material Interface
25%
Finite Element Simulation
25%
Area Substrate
25%
Liquid Phase
25%
Material Science
Silver
100%
Thermal Cycling
50%
Interface (Material)
50%
Finite Element Methods
50%