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Performance and Reliability of Bonded Interfaces for High-Temperature Packaging: Annual Report
Douglas DeVoto
Center for Integrated Mobility Sciences
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Dive into the research topics of 'Performance and Reliability of Bonded Interfaces for High-Temperature Packaging: Annual Report'. Together they form a unique fingerprint.
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Engineering
Power Electronics
100%
Bonded Interface
100%
Automotives
40%
Band Gap
40%
Degradation Mechanism
20%
Power Density
20%
Specific Power
20%
Material Development
20%
Processing Condition
20%
Silicon Device
20%
Package Design
20%
Performance Requirement
20%
Stress-Intensity Factor
20%
Reliability Evaluation
20%
Free Solder
20%
Flatness
20%
Electronic Module
20%
Material Science
Silver
100%
Silicon Device
100%
Stress Intensity Factor
100%
Density (Specific Gravity)
100%
Lead-Free Solder
100%