Phenol-Formaldehyde Resin Curing and Bonding Under Dynamic Conditions

    Research output: Contribution to journalArticlepeer-review


    The response of resin curing and bonding mechanisms to process variables such as time, temperature, moisture content (MC) and/or relative humidity (RH) is important in optimizing the wood composite manufacturing process. Little work has been done to directly measure the extent to curing and bonding achieved during pressing and to relate this to board performance. The purpose of this study was todevelop a method, based on the previous studies by Follensbee (1990) and Geimer and Christiansen (1994), to progressively monitor and characterize the resin curing and bonding process under dynamic conditions.
    Original languageAmerican English
    Pages (from-to)423-442
    Number of pages20
    JournalWood Science and Technology
    Issue number6
    StatePublished - 1996

    NREL Publication Number

    • NREL/JA-430-22910


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