Abstract
The response of resin curing and bonding mechanisms to process variables such as time, temperature, moisture content (MC) and/or relative humidity (RH) is important in optimizing the wood composite manufacturing process. Little work has been done to directly measure the extent to curing and bonding achieved during pressing and to relate this to board performance. The purpose of this study was todevelop a method, based on the previous studies by Follensbee (1990) and Geimer and Christiansen (1994), to progressively monitor and characterize the resin curing and bonding process under dynamic conditions.
| Original language | American English |
|---|---|
| Pages (from-to) | 423-442 |
| Number of pages | 20 |
| Journal | Wood Science and Technology |
| Volume | 30 |
| Issue number | 6 |
| DOIs | |
| State | Published - 1996 |
NREL Publication Number
- NREL/JA-430-22910