Abstract
Epitaxial crystal silicon films 2 to 10-microns thick on high-quality seed layers have the potential to approach wafer silicon photovoltaic efficiencies at thin-film area costs. Using hot-wire chemical vapor deposition (HWCVD) from silane precursor gas, we have grown epitaxial layers up to 40-microns thick with defect densities of about 2 x 105 cm-2, corresponding to defects separated by more than 20 μm. This should be adequate for film-silicon photovoltaic applications. Films are grown at rates above 100 nm/min, at about 680°C, a temperature compatible with relatively inexpensive substrates such as display glass. We have also grown both n- and p-type epitaxial layers with mobilities close to those of wafers and achieved epitaxy at a growth rate of 300 nm/min. We have not yet reached a fundamental limit to the deposition rate.
Original language | American English |
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Pages | 2492-2494 |
Number of pages | 3 |
DOIs | |
State | Published - 2009 |
Event | 2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009 - Philadelphia, PA, United States Duration: 7 Jun 2009 → 12 Jun 2009 |
Conference
Conference | 2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009 |
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Country/Territory | United States |
City | Philadelphia, PA |
Period | 7/06/09 → 12/06/09 |
NREL Publication Number
- NREL/CP-520-46033
Keywords
- materials science
- photovoltaics
- solar energy