Plasma Immersion Ion Implantation for Interdigitated Back Passivated Contact (IBPC) Solar Cells

David L. Young, William Nemeth, Vincenzo Lasalvia, Matthew R. Page, San Theingi, Matthew Young, Jeffery Aguiar, Benjamin G. Lee, Paul Stradins

Research output: Contribution to conferencePaperpeer-review

1 Scopus Citations


We present progress to develop low-cost interdigitated back contact solar cells with pc-Si/SiO2/c-Si passivated contacts formed by plasma immersion ion implantation (PIII). PIII is a lower-cost implantation technique than traditional beam-line implantation due to its simpler design, lower operating costs, and ability to run high doses (1E14-1E18 cm-2) at low ion energies (20 eV-10 keV). These benefits make PIII ideal for high throughput production of patterned passivated contacts, where high-dose, low-energy implantations are made into thin (20-200 nm) a-Si layers instead of into the wafer itself. For this work symmetric passivated contact test structures grown on n-Cz wafers with PH3 PIII doping gave implied open circuit voltage (iVoc) values of 730 mV with Jo values of 2 fA/cm2. Samples doped with B2H6 gave iVoc values of 690 mV and Jo values of 24 fA/cm2, outperforming BF3 doping, which gave iVoc values in the 660-680 mV range. Samples were further characterized by photoluminescence and SIMS depth profiles. Initial IBPC cell results are presented.

Original languageAmerican English
Number of pages5
StatePublished - 18 Nov 2016
Event43rd IEEE Photovoltaic Specialists Conference, PVSC 2016 - Portland, United States
Duration: 5 Jun 201610 Jun 2016


Conference43rd IEEE Photovoltaic Specialists Conference, PVSC 2016
Country/TerritoryUnited States

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

NREL Publication Number

  • NREL/CP-5J00-65827


  • ion implantation
  • passivated contacts
  • photovoltaic cells
  • plasma
  • Silicon


Dive into the research topics of 'Plasma Immersion Ion Implantation for Interdigitated Back Passivated Contact (IBPC) Solar Cells'. Together they form a unique fingerprint.

Cite this