Pool Boiling Reliability Tests and Degradation Mechanisms of Microporous Copper Inverse Opal (CuIOs) Structures

Material Science

• Silicon 100%
• Density 100%
• Thermal Conductivity 100%
• Corrosion 100%
• Aluminum Oxide 100%
• Electroless Deposition 100%
• Coolant 100%

Engineering

• Degradation Mechanism 100%
• Reliability Analysis 100%
• Porosity 66%
• Characteristic Length 33%
• Power Density 33%
• Aluminum Oxide 33%
• Silicon Substrate 33%
• Combined Effect 33%
• Constant Heat Flux 33%
• High Thermal Conductivity 33%
• Boiling Condition 33%
• Atomic Layer Deposition 33%
• Nickel Layer 33%
• Heat Flux 33%
• Electroless Plating 33%

Chemical Engineering

• Heat Flux 100%
• Atomic Layer Deposition 50%
• Electroless Plating 50%
• Thermal Conductivity 50%
• Deionized Water 50%