Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

Research output: NRELPoster


Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Accelerated experiments conducted at NREL reveal that high-lead solder joints have better reliability than sintered silver under extreme thermal cycling conditions. Furthermore, efforts to develop a crack propagation model for the high-temperature materials are described.
Original languageAmerican English
StatePublished - 2021

Publication series

NamePresented at the 2021 DOE Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 21-25 June 2021

NREL Publication Number

  • NREL/PO-5400-79923


  • lifetime model
  • reliability
  • sintered silver
  • transient liquid phase bonds


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