Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

Research output: NRELPoster


High temperature operation of wide bandgap devices continue to be a challenge for the power electronics packages. Thermal performance and reliability are important factors that determine the viability of a bonded interface for operation at high temperatures. In this presentation, we present the technical approach and key results from the research on sintered silver, transient liquid phase alloy, and polymeric materials. A lifetime prediction model that incorporates the thermomechanical behavior of sintered silver at 200C was developed. The copper-aluminum transient alloy completed 350 thermal cycles from -40C to 200C and little increase in the defect level was observed. In addition to material research, we initiated a time-series analysis on the scanning acoustic microscope images of eutectic solder to explore statistical forecasting methods and machine learning techniques. Initial results that report the accuracy of a few different statistical models are presented.
Original languageAmerican English
StatePublished - 2022

Publication series

NamePresented at the 2022 Vehicle Technologies Office Annual Merit Review, 21-23 June 2022, Washington, D.C.

NREL Publication Number

  • NREL/PO-5400-82682


  • power electronics
  • reliability
  • sintered silver
  • time-series analysis


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