@misc{54e848b1f7d94e99ab76b4ce7836ad73,
title = "Power Electronics Module with Integrated Ceramic Heat Exchanger",
abstract = "NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.",
keywords = "additive manufacturing, aluminum nitride, ceramics, packaging, power electronics, silicon carbide, substrates, thermal modeling",
author = "Douglas DeVoto and Gilbert Moreno and Paul Paret and Joshua Major and Mike Tant and Steve Farias and Adam Peters and Adam Steinmark and Itso Ivanov and Terri Zimmerman and Andrew Paulsen and Kassie DuChene-McVay",
year = "2025",
doi = "10.2172/3014996",
language = "American English",
series = "Presented at the Fifth International Symposium on 3D Power Electronics Integration \& Manufacturing (3D-PEIM), 8-10 July 2025, Golden, Colorado",
type = "Other",
}