Power Electronics Thermal Management

Research output: NRELPresentation


This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (250°C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers that will present reliability challenges and require higher-temperature substrates and bonding materials.
Original languageAmerican English
Number of pages28
StatePublished - 2020

Publication series

NamePresented at the 2020 Vehicle Technologies Office Annual Merit Review and Peer Evaluation Meeting, 1-4 June 2020

NREL Publication Number

  • NREL/PR-5400-76669


  • dielectric fluids
  • power electronics
  • thermal management
  • wide-bandgap


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