Abstract
The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Device- and system-level thermal analyses are conducted to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.
| Original language | American English |
|---|---|
| Number of pages | 16 |
| State | Published - 2016 |
NREL Publication Number
- NREL/MP-5400-64943
Keywords
- power electronics
- thermal management
- WBG
- wide-bandgap