@misc{f743986506654e2cb762c13bd1bf6f30,
title = "Power Electronics Thermal Management R&D (Presentation): NREL (National Renewable Energy Laboratory)",
abstract = "This project will investigate and develop thermal-management strategies for wide bandgap (WBG)-based power electronics systems. Research will be carried out to deal with thermal aspects at the module- and system-level. Module-level research will focus on die- and substrate-integrated cooling strategies and heat-transfer enhancement technologies. System-level research will focus onthermal-management strategies for the entire power electronics system to enable smart packaging solutions. One challenge with WBG device-based power electronics is that although losses in the form of heat may be lower, the footprint of the components is also likely to be reduced to reduce cost, weight, and volume. Combined with higher operational temperatures, this creates higher heat fluxeswhich much be removed from a smaller footprint, requiring advanced cooling strategies.",
keywords = "inverter cooling, power electronics, thermal management",
author = "Scot Waye",
year = "2014",
language = "American English",
series = "Presented at the FY15 APEEM Kickoff Meeting, 18-20 November 2014, Oak Ridge National Laboratory, Oak Ridge, Tennessee",
type = "Other",
}