Printed Module Interconnects

Jeremy Fields, Scott Mauger, Marinus Van Hest, Talysa Stockert, Gregory Pach

Research output: Contribution to conferencePaper


Monolithic interconnects in photovoltaic modules connect adjacent cells in series, and are typically formed sequentially involving multiple deposition and scribing steps. Interconnect widths of 500 um every 10 mm result in 5% dead area, which does not contribute to power generation in an interconnected solar panel. This work expands on previous work that introduced an alternative interconnection method capable of producing interconnect widths less than 100 um. The interconnect is added to the module in a single step after deposition of the photovoltaic stack, eliminating the need for scribe alignment. This alternative method can be used for all types of thin film photovoltaic modules. Voltage addition with copper-indium-gallium-diselenide (CIGS) solar cells using a 2-scribe printed interconnect approach is demonstrated. Additionally, interconnect widths of 250 um are shown.
Original languageAmerican English
Number of pages4
StatePublished - 2015
Event2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) - New Orleans, Louisiana
Duration: 14 Jun 201519 Jun 2015


Conference2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC)
CityNew Orleans, Louisiana

NREL Publication Number

  • NREL/CP-5K00-63593


  • atmospheric processing
  • interconnects
  • photovoltaics


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