Properties of Encapsulation Materials and Their Relevance for Recent Field Failures

Juliane Berghold, Simon Koch, Benny Frohmann, Peter Hacke, Paul Grunow

Research output: Contribution to conferencePaperpeer-review

31 Scopus Citations

Abstract

Different encapsulation materials are investigated in terms of their PID-suppressing properties. In order to identify materials with a high potential for PID suppression, PID testing was conducted according to test protocols covering system voltages up to 1500 V and particularly long exposure times. Volume resistivity measurements at different temperatures and relative humidity are presented for the different encapsulation materials using 'fresh' and aged samples to simulate relevant field conditions and to correlate with PID test results and field findings.

Original languageAmerican English
Pages1987-1992
Number of pages6
DOIs
StatePublished - 15 Oct 2014
Event40th IEEE Photovoltaic Specialist Conference, PVSC 2014 - Denver, United States
Duration: 8 Jun 201413 Jun 2014

Conference

Conference40th IEEE Photovoltaic Specialist Conference, PVSC 2014
Country/TerritoryUnited States
CityDenver
Period8/06/1413/06/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

NREL Publication Number

  • NREL/CP-5J00-62200

Keywords

  • encapsulation
  • Long-term stability
  • PID
  • volume resistivity

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