Properties of Encapsulation Materials and Their Relevance for Recent Field Failures

Juliane Berghold; Simon Koch; Benny Frohmann; Peter Hacke; Paul Grunow

doi:10.1109/PVSC.2014.6925315

Properties of Encapsulation Materials and Their Relevance for Recent Field Failures

Juliane Berghold, Simon Koch, Benny Frohmann, Peter Hacke, Paul Grunow

Materials Science

PI Photovoltaik Institut Berlin AG

Research output: Contribution to conference › Paper › peer-review

33 Scopus Citations

Abstract

Different encapsulation materials are investigated in terms of their PID-suppressing properties. In order to identify materials with a high potential for PID suppression, PID testing was conducted according to test protocols covering system voltages up to 1500 V and particularly long exposure times. Volume resistivity measurements at different temperatures and relative humidity are presented for the different encapsulation materials using 'fresh' and aged samples to simulate relevant field conditions and to correlate with PID test results and field findings.

Original language	American English
Pages	1987-1992
Number of pages	6
DOIs	https://doi.org/10.1109/PVSC.2014.6925315 https://doi.org/10.1109/PVSC.2014.6925315
State	Published - 15 Oct 2014
Event	40th IEEE Photovoltaic Specialist Conference, PVSC 2014 - Denver, United States Duration: 8 Jun 2014 → 13 Jun 2014

Conference

Conference	40th IEEE Photovoltaic Specialist Conference, PVSC 2014
Country/Territory	United States
City	Denver
Period	8/06/14 → 13/06/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

NREL Publication Number

NREL/CP-5J00-62200

Keywords

encapsulation
Long-term stability
PID
volume resistivity

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AU - Berghold, Juliane

AU - Koch, Simon

AU - Frohmann, Benny

AU - Hacke, Peter

AU - Grunow, Paul

PY - 2014/10/15

Y1 - 2014/10/15

N2 - Different encapsulation materials are investigated in terms of their PID-suppressing properties. In order to identify materials with a high potential for PID suppression, PID testing was conducted according to test protocols covering system voltages up to 1500 V and particularly long exposure times. Volume resistivity measurements at different temperatures and relative humidity are presented for the different encapsulation materials using 'fresh' and aged samples to simulate relevant field conditions and to correlate with PID test results and field findings.

AB - Different encapsulation materials are investigated in terms of their PID-suppressing properties. In order to identify materials with a high potential for PID suppression, PID testing was conducted according to test protocols covering system voltages up to 1500 V and particularly long exposure times. Volume resistivity measurements at different temperatures and relative humidity are presented for the different encapsulation materials using 'fresh' and aged samples to simulate relevant field conditions and to correlate with PID test results and field findings.

KW - encapsulation

KW - Long-term stability

KW - PID

KW - volume resistivity

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DO - 10.1109/PVSC.2014.6925315

M3 - Paper

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T2 - 40th IEEE Photovoltaic Specialist Conference, PVSC 2014

Y2 - 8 June 2014 through 13 June 2014

ER -

Properties of Encapsulation Materials and Their Relevance for Recent Field Failures

Abstract

Conference

Bibliographical note

NREL Publication Number

Keywords

Access to Document

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