Rapid Thermal Processing by Stamping

A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp having a stamping surface and a heater or cooler to bring it to a selected processing temperature, a sample holder for holding a sample in position for intimate contact with the stamping surface; and positioning components formoving the stamping surface and the stamp in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.