Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading

Laura Spinella; Kent Terwilliger; Patrick Walker; Greg Perrin; Chun-Sheng Jiang; Nick Bosco

doi:10.1109/PVSC43889.2021.9518566

Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading

Laura Spinella, Kent Terwilliger, Patrick Walker, Greg Perrin, Chun-Sheng Jiang, Nick Bosco

Materials Science

Research output: Contribution to conference › Paper › peer-review

1 Scopus Citations

Abstract

Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.

Original language	American English
Pages	108-111
Number of pages	4
DOIs	https://doi.org/10.1109/PVSC43889.2021.9518566 https://doi.org/10.1109/PVSC43889.2021.9518566
State	Published - 20 Jun 2021
Event	48th IEEE Photovoltaic Specialists Conference, PVSC 2021 - Fort Lauderdale, United States Duration: 20 Jun 2021 → 25 Jun 2021

Conference

Conference	48th IEEE Photovoltaic Specialists Conference, PVSC 2021
Country/Territory	United States
City	Fort Lauderdale
Period	20/06/21 → 25/06/21

Bibliographical note

See NREL/CP-5K00-78915 for preprint

NREL Publication Number

NREL/CP-5K00-81137

Keywords

atomic force microscopy (AFM)
dynamic mechanical loading (DML)
low temperature solder
multiwire
wear

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Spinella, L., Terwilliger, K., Walker, P., Perrin, G., Jiang, C.-S., & Bosco, N. (2021). Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading. 108-111. Paper presented at 48th IEEE Photovoltaic Specialists Conference, PVSC 2021, Fort Lauderdale, United States. https://doi.org/10.1109/PVSC43889.2021.9518566, https://doi.org/10.1109/PVSC43889.2021.9518566

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abstract = "Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.",

keywords = "atomic force microscopy (AFM), dynamic mechanical loading (DML), low temperature solder, multiwire, wear",

author = "Laura Spinella and Kent Terwilliger and Patrick Walker and Greg Perrin and Chun-Sheng Jiang and Nick Bosco",

note = "See NREL/CP-5K00-78915 for preprint; 48th IEEE Photovoltaic Specialists Conference, PVSC 2021 ; Conference date: 20-06-2021 Through 25-06-2021",

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Spinella, L, Terwilliger, K , Walker, P , Perrin, G , Jiang, C-S & Bosco, N 2021, 'Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading', Paper presented at 48th IEEE Photovoltaic Specialists Conference, PVSC 2021, Fort Lauderdale, United States, 20/06/21 - 25/06/21 pp. 108-111. https://doi.org/10.1109/PVSC43889.2021.9518566, https://doi.org/10.1109/PVSC43889.2021.9518566

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T1 - Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading

AU - Spinella, Laura

AU - Terwilliger, Kent

AU - Walker, Patrick

AU - Perrin, Greg

AU - Jiang, Chun-Sheng

AU - Bosco, Nick

N1 - See NREL/CP-5K00-78915 for preprint

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N2 - Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.

AB - Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.

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KW - dynamic mechanical loading (DML)

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T2 - 48th IEEE Photovoltaic Specialists Conference, PVSC 2021

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ER -

Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading

Abstract

Conference

Bibliographical note

NREL Publication Number

Keywords

Access to Document

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