Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments: Paper No. IPACK2023-113781

Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan Dede, James Palko, Kenneth Goodson

Research output: Contribution to conferencePaper

Abstract

This paper explores copper inverse opal (CIO) surface reliability in pool boiling experiments in water and a new, low- global-warming-potential (GWP = 1) hydrofluoroolefin (HFO) refrigerant R-1233zd. The CIO-based structure is intended to develop enhanced two-phase heat transfer surfaces for extreme- heat-flux (~1 kW/cm 2) micro-coolers. In this study, a limited number of pool boiling experiments were performed using water and HFO-1233zd fluid, and the reliability of the CIO-based surfaces was evaluated. Critical heat flux (CHF) values in HFO- 1233zd at 40 degrees C-45 degrees C saturation temperatures and the corresponding saturation pressures were also measured. The CHF values with the refrigerant are significantly lower compared to those with water, but the refrigerant allows for a wider usable temperature range in the end application of the micro-coolers and is not limited to data centers with controlled ambient conditions. Reliability experiments with CIO surface samples - involving pool boiling with water on the CIO surfaces for approximately 48 hours and with HFO-1233zd for 144 hours - showed no structural degradation of the enhanced surface or any significant performance drop in heat transfer coefficients. The CIO surface samples in water were oxidized, most likely due to the presence of air in water and in the experimental vessel.
Original languageAmerican English
Number of pages8
DOIs
StatePublished - 2023
EventASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - InterPACK2023 - San Diego, CA, USA
Duration: 24 Oct 202326 Oct 2023

Conference

ConferenceASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - InterPACK2023
CitySan Diego, CA, USA
Period24/10/2326/10/23

NREL Publication Number

  • NREL/CP-5400-86218

Keywords

  • critical heat flux
  • data centers
  • extreme heat flux
  • power electronics
  • surface enhancement
  • thermal management
  • two-phase heat transfer

Fingerprint

Dive into the research topics of 'Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments: Paper No. IPACK2023-113781'. Together they form a unique fingerprint.

Cite this