Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Engineering

• Bonded Interface 100%
• Power Electronics 50%
• Material Interface 50%
• Strain Energy Density 50%
• Finite Element Analysis 50%
• Thermal Performance 25%
• Automotives 25%
• Baseplate 25%
• Thermal Cycle 25%
• Nitride 25%
• Coefficient of Thermal Expansion 25%
• Accelerated Test 25%
• Grease 25%
• Plate Sample 25%
• Polyamide 25%
• Heat Removal 25%
• Scanning Acoustic Microscopy 25%
• Reliability Issue 25%
• Reliability Evaluation 25%
• Electronic Packaging 25%
• Dwell Period 25%
• Phase Change Material 25%
• Heat Resistance 25%
• Delamination 25%

Material Science

• Interface (Material) 100%
• Thermal Cycling 50%
• Energy Density 33%
• Finite Element Methods 33%
• Carbon Fiber 33%
• Thermoplastics 33%
• Silicon Nitride 16%
• Thermal Expansion 16%
• Heat Resistance 16%
• Phase Change Material 16%
• Polyamide 16%
• Thermal Shock 16%
• Scanning Acoustic Microscopy 16%
• Delamination 16%