Reliability Testing the Die-Attach of CPV Cell Assemblies

Research output: Contribution to conferencePaper

Abstract

Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ~1 cm2 multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both in-situ and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.
Original languageAmerican English
Number of pages9
StatePublished - 2011
Event34th IEEE Photovoltaic Specialists Conference (PVSC '09) - Philadelphia, Pennsylvania
Duration: 7 Jun 200912 Jun 2009

Conference

Conference34th IEEE Photovoltaic Specialists Conference (PVSC '09)
CityPhiladelphia, Pennsylvania
Period7/06/0912/06/09

NREL Publication Number

  • NREL/CP-5200-46058

Keywords

  • CPV
  • die-attach
  • reliability testing
  • thermal cycling

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