Reliability Testing the Die-Attach of CPV Cell Assemblies

Reliability Testing the Die-Attach of CPV Cell Assemblies

Research output: Contribution to conference › Paper

Abstract

Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ~1 cm2 multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both in-situ and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.

Original language	American English
Number of pages	9
State	Published - 2011
Event	34th IEEE Photovoltaic Specialists Conference (PVSC '09) - Philadelphia, Pennsylvania Duration: 7 Jun 2009 → 12 Jun 2009

Conference

Conference	34th IEEE Photovoltaic Specialists Conference (PVSC '09)
City	Philadelphia, Pennsylvania
Period	7/06/09 → 12/06/09

NREL Publication Number

NREL/CP-5200-46058

Keywords

CPV
die-attach
reliability testing
thermal cycling

Access to Document

https://www.nrel.gov/docs/fy11osti/46058.pdf

Cite this

@conference{195e3656a91343f3a47a705d51ffe2b9,

title = "Reliability Testing the Die-Attach of CPV Cell Assemblies",

abstract = "Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ~1 cm2 multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both in-situ and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.",

keywords = "CPV, die-attach, reliability testing, thermal cycling",

author = "NREL",

year = "2011",

language = "American English",

note = "34th IEEE Photovoltaic Specialists Conference (PVSC '09) ; Conference date: 07-06-2009 Through 12-06-2009",

}

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T1 - Reliability Testing the Die-Attach of CPV Cell Assemblies

AU - NREL, null

PY - 2011

Y1 - 2011

N2 - Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ~1 cm2 multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both in-situ and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.

AB - Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ~1 cm2 multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both in-situ and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.

KW - CPV

KW - die-attach

KW - reliability testing

KW - thermal cycling

M3 - Paper

T2 - 34th IEEE Photovoltaic Specialists Conference (PVSC '09)

Y2 - 7 June 2009 through 12 June 2009

ER -

Reliability Testing the Die-Attach of CPV Cell Assemblies

Abstract

Conference

NREL Publication Number

Keywords

Access to Document

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Cite this