Reliability Testing the Die-Attach of CPV Cell Assemblies

Nick Bosco, Cassi Sweet, Sarah Kurtz

Research output: Contribution to conferencePaperpeer-review

8 Scopus Citations

Abstract

Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ∼1 cm2 multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both insitu and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.

Original languageAmerican English
Pages917-922
Number of pages6
DOIs
StatePublished - 2009
Event2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009 - Philadelphia, PA, United States
Duration: 7 Jun 200912 Jun 2009

Conference

Conference2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009
Country/TerritoryUnited States
CityPhiladelphia, PA
Period7/06/0912/06/09

NREL Publication Number

  • NREL/CP-520-50789

Fingerprint

Dive into the research topics of 'Reliability Testing the Die-Attach of CPV Cell Assemblies'. Together they form a unique fingerprint.

Cite this