Abstract
This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup.
| Original language | American English |
|---|---|
| Number of pages | 12 |
| State | Published - 2010 |
| Event | 2009 ASME International Mechanical Engineering Conference and Exposition - Lake Buena Vista, Florida Duration: 13 Nov 2009 → 19 Nov 2009 |
Conference
| Conference | 2009 ASME International Mechanical Engineering Conference and Exposition |
|---|---|
| City | Lake Buena Vista, Florida |
| Period | 13/11/09 → 19/11/09 |
NREL Publication Number
- NREL/CP-540-46417
Keywords
- power electronics
- power electronics cooling
- solder joint fatigue analysis