SiC Power Electronics in Medium Voltage Motor Drives: Trade and Manufacturing Analysis

Samantha Bench Reese, Kelsey Horowitz, Margaret Mann, Timothy Remo

Research output: NRELPoster


Wide bandgap (WBG) semiconductor devices are increasingly being considered for use in certain power electronics applications, where they can improve efficiency, performance, footprint, and, potentially, total system cost compared to systems using traditional silicon (Si) devices. Silicon carbide (SiC) devices in particular -- which are currently more mature than other WBG devices -- are poised for growth in the coming years. Today, the manufacturing of SiC wafers is concentrated in the United States, and chip production is split roughly equally between the United States, Japan, and Europe. Established contract manufacturers located throughout Asia typically carry out manufacturing of WBG power modules. We seek to understand how global manufacturing of SiC components may evolve over time by illustrating the regional cost drivers along the supply chain and providing an overview of other factors that influence where manufacturing is sited. We conduct this analysis for a particular case study where SiC devices are used in a medium-voltage motor drive.
Original languageAmerican English
StatePublished - 2017

Publication series

NamePresented at the International Conference on Silicon Carbide and Related Materials, 17-22 September 2017, Washington, D.C.

NREL Publication Number

  • NREL/PO-6A20-70111


  • cost
  • manufacturing
  • SiC
  • silicon carbide
  • WBG
  • wide bandgap semiconductors


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