Simulation and Experiment of Thermal Fatigue in the CPV Die Attach: Preprint

Nicholas Bosco

Simulation and Experiment of Thermal Fatigue in the CPV Die Attach: Preprint

Materials Science

Research output: Contribution to conference › Paper

Abstract

FEM simulation and accelerated thermal cycling have been performed for the CPV die attach. Trends in fatigue damage accumulation and equivalent test time are explored and found to be most sensitive to temperature ramp rate. Die attach crack growth is measured through cycling and found to be in excellent agreement with simulations of the inelastic strain energy accumulated. Simulations of anentire year of weather data provides for the relative ranking of fatigue damage between four cites as well as their equivalent accelerated test time.

Original language	American English
Number of pages	7
State	Published - 2012
Event	8th International Conference on Concentrating PV Systems (CPV-8) - Toledo, Spain Duration: 16 Apr 2012 → 18 Apr 2012

Conference

Conference	8th International Conference on Concentrating PV Systems (CPV-8)
City	Toledo, Spain
Period	16/04/12 → 18/04/12

NREL Publication Number

NREL/CP-5200-54915

Keywords

accelerated lifetime testing
CPV
die attach
FEM
solder
strain energy
thermal fatigue

Access to Document

https://www.nrel.gov/docs/fy12osti/54915.pdf

Cite this

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title = "Simulation and Experiment of Thermal Fatigue in the CPV Die Attach: Preprint",

abstract = "FEM simulation and accelerated thermal cycling have been performed for the CPV die attach. Trends in fatigue damage accumulation and equivalent test time are explored and found to be most sensitive to temperature ramp rate. Die attach crack growth is measured through cycling and found to be in excellent agreement with simulations of the inelastic strain energy accumulated. Simulations of anentire year of weather data provides for the relative ranking of fatigue damage between four cites as well as their equivalent accelerated test time.",

keywords = "accelerated lifetime testing, CPV, die attach, FEM, solder, strain energy, thermal fatigue",

author = "Nicholas Bosco",

year = "2012",

language = "American English",

note = "8th International Conference on Concentrating PV Systems (CPV-8) ; Conference date: 16-04-2012 Through 18-04-2012",

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TY - CONF

T1 - Simulation and Experiment of Thermal Fatigue in the CPV Die Attach: Preprint

AU - Bosco, Nicholas

PY - 2012

Y1 - 2012

N2 - FEM simulation and accelerated thermal cycling have been performed for the CPV die attach. Trends in fatigue damage accumulation and equivalent test time are explored and found to be most sensitive to temperature ramp rate. Die attach crack growth is measured through cycling and found to be in excellent agreement with simulations of the inelastic strain energy accumulated. Simulations of anentire year of weather data provides for the relative ranking of fatigue damage between four cites as well as their equivalent accelerated test time.

AB - FEM simulation and accelerated thermal cycling have been performed for the CPV die attach. Trends in fatigue damage accumulation and equivalent test time are explored and found to be most sensitive to temperature ramp rate. Die attach crack growth is measured through cycling and found to be in excellent agreement with simulations of the inelastic strain energy accumulated. Simulations of anentire year of weather data provides for the relative ranking of fatigue damage between four cites as well as their equivalent accelerated test time.

KW - accelerated lifetime testing

KW - CPV

KW - die attach

KW - FEM

KW - solder

KW - strain energy

KW - thermal fatigue

M3 - Paper

T2 - 8th International Conference on Concentrating PV Systems (CPV-8)

Y2 - 16 April 2012 through 18 April 2012

ER -

Simulation and Experiment of Thermal Fatigue in the CPV Die Attach: Preprint

Abstract

Conference

NREL Publication Number

Keywords

Access to Document

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Cite this