Simulation and Experiment of Thermal Fatigue in the CPV Die Attach

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8 Scopus Citations

Abstract

FEM simulation and accelerated thermal cycling have been performed for the CPV die attach. Trends in fatigue damage accumulation and equivalent test time are explored and found to be most sensitive to temperature ramp rate. Die attach crack growth is measured through cycling and found to be in excellent agreement with simulations of the inelastic strain energy accumulated. Simulations of an entire year of weather data provides for the relative ranking of fatigue damage between four cities as well as their equivalent accelerated test time.

Original languageAmerican English
Pages267-271
Number of pages5
DOIs
StatePublished - 2012
Event8th International Conference on Concentrating Photovoltaic Systems, CPV 2012 - Toledo, Spain
Duration: 16 Apr 201218 Apr 2012

Conference

Conference8th International Conference on Concentrating Photovoltaic Systems, CPV 2012
Country/TerritorySpain
CityToledo
Period16/04/1218/04/12

Bibliographical note

See CP-5200-54915 for preprint

NREL Publication Number

  • NREL/CP-5200-56971

Keywords

  • Accelerated lifetime testing
  • CPV
  • Die attach
  • FEM
  • Solder
  • Strain energy
  • Thermal fatigue

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